Anotherm Plus® is a thickfilm technology on metal substrates with the aim of minimising thermal resistance as well as significant thermal management. A simple and flexible packaging technique supports LED front light and power electronics applications.
Scope of application is e.g. Power-LED-Substrates or power electronics.
Typical features and benefits
- Low thermal resistance
- Robust light weight substrates, e.g. Aluminium
- Simple and fully automated manufacturing
- Cost-savings through reduction of assembly effort
Anotherm Plus® directly on extruded heat sink
- Heat sink is also substrate, interface material is eliminated
- Cost reduction as no circuit boards are needed, e.g. FR4, IMS, ceramic
- Higher reliability through reduction of assembly effort and layers