8998

TaNFilm Precision FP (flat pack) Resistor Network, 16 pin bussed

Lifecycle:

Active (Mature)

Brand:

IRC

Series:

8900

Specifications

Series 8900
Application Network / array Precision
Mounting SMD - solder
Package Network ceramic
Technology TaN film
Approval None
Example MPN FP-8998-03-1001-B-F
Termination Options
  • Pb-free
  • Pb-bearing
Power 0.025W
Rated Ambient Temperature 70°C
De-rate to 0W Ambient Temperature 125°C
Max Ambient Temperature 125°C
LEV 50V
Resistance min 50Ω
Resistance max 150kΩ
Critical Resistance (where applying LEV dissipates Pr) 100kΩ
Best Tolerance 0.1%
Best TCR 5ppm/°C
Isolation Voltage of Insulation Unspecified: ?V
RoHS Compliant (if Pb-free) Yes (see below)
RoHS Exemption None
China RoHS (if Pb-free) Compliant
REACH Status (if Pb-free) See REACH statement pdf (below)
CMRT Conflict Mineral Status See CMRT Excel file (below)
EMRT Extended Mineral Status See EMRT Excel file (below)
Termination Finish (if Pb-free) e4 - Au
Termination Finish (if Pb-bearing) 60/40
How to Specify Pb-Free No SD after 8998
ECCN EAR99
Packing Tube
Quantity 50
Nett Weight Each -
Reflow Process J-STD-020E
MSL 1
Wave Process Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time
Shelf-life None defined, but solderability test prior to use is recommended after two years from date of manufacture
Launch Date Pre-2000
Lifecycle Active (Mature)
EOL Date / YTEOL Estimate 5 years or more. (Reviewed May 24)
Latest PCN Date 15 Jul 20
Alternative Part Number -

Resources & Technical Documents

  • All (21)
  • 3D Model (0)
  • Case Study (0)
  • Technical Bulletin (0)
  • Video (0)
  • Policy & Regulations (0)
  • Terms & Conditions (0)
  • White Paper (0)
  • End Of Life (0)
  • Datasheet (1)
  • Application Note (7)
  • Brochure (2)
  • Compliance (10)
  • Product Change Notification (1)