Lifecycle:
Active (Mature)
Brand:
IRC
Series:
MIL-CHIP
Series | MIL-CHIP |
---|---|
Application | High reliability |
Mounting | SMD - solder |
Package | Chip 0402 |
Technology | TaN film |
Approval | MIL-PRF-55342 |
Example MPN | M55342H11B1R00S |
Termination Options | Pb-bearing |
Power | 0.05W |
---|---|
Rated Ambient Temperature | 70°C |
De-rate to 0W Ambient Temperature | 150°C |
Max Ambient Temperature | 150°C |
LEV | 30V |
Resistance min | 51Ω |
Resistance max | 30kΩ |
Critical Resistance (where applying LEV dissipates Pr) | 18kΩ |
Best Tolerance | 0.1% |
Best TCR | 25ppm/°C |
Isolation Voltage of Insulation | Unspecified: ?V |
RoHS Compliant (if Pb-free) | No |
---|---|
RoHS Exemption | - |
China RoHS (if Pb-free) | Contains Pb. EFUP not established |
REACH Status (if Pb-free) | See REACH statement pdf (below) |
CMRT Conflict Mineral Status | See CMRT Excel file (below) |
EMRT Extended Mineral Status | See EMRT Excel file (below) |
Termination Finish (if Pb-free) | None |
Termination Finish (if Pb-bearing) | 60/40 |
How to Specify Pb-Free | Not available |
ECCN | EAR99 |
Packing | Plastic tape & reel |
---|---|
Quantity | 500 |
Nett Weight Each | - |
Reflow Process | J-STD-020E |
MSL | 1 |
Wave Process | Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time |
Shelf-life | None defined, but solderability test prior to use is recommended after two years from date of manufacture |
Launch Date | Pre-2000 |
---|---|
Lifecycle | Active (Mature) |
EOL Date / YTEOL Estimate | 5 years or more. (Reviewed May 24) |
Latest PCN Date | 11 Apr 22 |
Alternative Part Number | - |