| Series | WIN |
|---|---|
| Application | Precision |
| Mounting | SMD - solder |
| Package | Chip 1206 |
| Technology | TaN film |
| Approval | None |
| Example MPN | WINT1206LF031001B3 or WIN-T1206LF-03-1001-B |
| Termination Options |
|
| Power | 0.33W |
|---|---|
| Rated Ambient Temperature | 70°C |
| De-rate to 0W Ambient Temperature | 150°C |
| Max Ambient Temperature | 150°C |
| LEV | 200V |
| Resistance min | 4.99Ω |
| Resistance max | 1MΩ |
| Critical Resistance (where applying LEV dissipates Pr) | 121kΩ |
| Best Tolerance | 0.05% |
| Best TCR | 10ppm/°C |
| Isolation Voltage of Insulation | Unspecified: ?V |
| RoHS Compliant (if Pb-free) | Yes (see below) |
|---|---|
| RoHS Exemption | None |
| China RoHS (if Pb-free) | Compliant |
| REACH Status (if Pb-free) | See REACH statement pdf (below) |
| CMRT Conflict Mineral Status | See CMRT Excel file (below) |
| EMRT Extended Mineral Status | See EMRT Excel file (below) |
| Termination Finish (if Pb-free) | e3 - Sn matt plated |
| Termination Finish (if Pb-bearing) | 60/40 |
| How to Specify Pb-Free | Part number has LF after type |
| ECCN | EAR99 |
| Packing | Plastic tape & reel |
|---|---|
| Quantity | 3000 |
| Nett Weight Each | - |
| Reflow Process | J-STD-020E |
| MSL | 1 |
| Wave Process | Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time |
| Shelf-life | None defined, but solderability test prior to use is recommended after two years from date of manufacture |
| Launch Date | Nov 2014 |
|---|---|
| Lifecycle | Obsolete |
| EOL Date / YTEOL Estimate | EOL in Jan 2025 |
| Latest PCN Date | 7 Jan 25 |
| Alternative Part Number | PFC-W1206 |